Method of packaging fragile devices with a gel medium confined b

Details Method of packaging fragile devices with a gel medium confined b Method of packaging fragile devices with a gel medium confined b

1997-09-26

2000-02-01

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438122, 438124, 438126, H01L 2152, H01L 2154, H01L 2156, H01L 2158

Patent

active

06020219&

ABSTRACT:
A fragile device, such as an integrated circuit chip or a multichip assembly, is packaged by first dispensing a sol surrounding the sides of the device. The sol is laterally confined by means of a rim member typically made of a pre-molded plastic material. The amount of the sol dispensed is not sufficient to run over the top of the rim member. The sol is then heated to form a gel. If desired, a cover member can be put into place onto the top surface of the rim member, for the purpose of additional mechanical protection of the fragile device, for example.

REFERENCES:
patent: 3308525 (1967-03-01), Tsuji
patent: 3863192 (1975-01-01), Grey
patent: 4339768 (1982-07-01), Keller et al.
patent: 4557514 (1985-12-01), Cushman et al.
patent: 4812897 (1989-03-01), Narita et al.
patent: 4849803 (1989-07-01), Yamamoto et al.
patent: 4914269 (1990-04-01), Kinsman et al.
patent: 4961106 (1990-10-01), Butt et al.
patent: 5087964 (1992-02-01), Hatta
patent: 5130889 (1992-07-01), Hamburgen et al.
patent: 5249977 (1993-10-01), Tanaka
patent: 5257162 (1993-10-01), Crafts
patent: 5266827 (1993-11-01), Kato
patent: 5317196 (1994-05-01), Wong
patent: 5399805 (1995-03-01), Tyler et al.
patent: 5439240 (1995-08-01), Narita et al.
patent: 5473512 (1995-12-01), Degani et al.
patent: 5477067 (1995-12-01), Isomura et al.

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