Process for manufacturing microstructure

Details Process for manufacturing microstructure Process for manufacturing microstructure

1997-04-28

2000-02-01

Fourson, George

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438459, 216 11, H01L 21311

Patent

active

060202157

ABSTRACT:
A microstructure comprising a substrate (1), a patterned structure (beam member) (2) suspended over the substrate (1) with an air-space (4) therebetween and supporting structure (3) for suspending the patterned structure (2) over the substrate (1). The microstructure is prepared by using a sacrificial layer (7) which is removed to form the space between the substrate (1) and the patterned structure (2) adhered to the sacrificial layer. In the case of using resin as the material of the sacrificial layer, the sacrificial layer can be removed without causing sticking, and an electrode can be provided on the patterned structure. The microstructure can have application as electrostatic actuator, etc., depending on choice of shape and composition.

REFERENCES:
patent: 5595942 (1997-01-01), Albrecht et al.
patent: 5665250 (1997-09-01), Iwata et al.
patent: 5753134 (1998-05-01), Biebl
patent: 5789264 (1998-04-01), Chung
patent: 5844287 (1998-12-01), Hassan et al.

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