Semiconductor device including a flip-chip substrate

Details Semiconductor device including a flip-chip substrate Semiconductor device including a flip-chip substrate

1998-09-30

1999-07-06

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

287667, 287774, H01L 2348, H01L 23495

Patent

active

059201266

ABSTRACT:
A semiconductor device includes a flip-chip substrate carrying thereon a conductor pattern and an insulation film, a cutout formed in the insulation film so as to expose a part of the conductor pattern, a semiconductor chip mounted on the flip-chip substrate and carrying electrodes in electrical contact with the conductor pattern exposed by the cutout, and a resin layer filling a space formed between the semiconductor chip and the flip-chip substrate, wherein the cutout is provided in correspondence to the electrodes and extends continuously to form a closed loop.

REFERENCES:
patent: 5394490 (1995-02-01), Kato et al.
patent: 5751060 (1998-05-01), Laine et al.
patent: 5786230 (1998-07-01), Anderson et al.
patent: 5844319 (1998-12-01), Gamota et al.

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