Process for producing printed wiring board

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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522117, 522121, 522173, 522178, 522182, 522183, 526302, 526308, 526313, 526320, 5263232, G03C 1725, C08J 328

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059196033

ABSTRACT:
In an additive process for producing printed wiring boards, by using a developer comprising a chlorine-free organic solvent and an alkaline aqueous solution and as a resist material a copolymer of methacrylic acid and methyl methacrylate or the like, the production steps are simplified even if a substrate having a large area is used, and abolishment of chlorine-containing organic solvent as a developer becomes possible.

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patent: 5700576 (1997-12-01), Brehm et al.
Printed Circuit World Convention 2, Jun. 5, 1987, Tokyo, Japan, p. WC-68, K. Masui, et al "Resist for Photo-Additive Printed Wiring Boards".
Database WPI, Week 9003, Derwent Publications Ltd., London, GB;.
Patent Abstracts of Japan, vol. 13, No. 180 (P-864) Apr. 27, 1989.

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