Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-03-10
1989-03-14
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566591, 156668, 156904, 427 431, 427 541, 430296, B44C 122, B29C 3700, C03C 1500, C03C 2506
Patent
active
048122009
ABSTRACT:
In generating resist structures according to bilayer technology a series of requirements is made of silicon-containing positive resists. The new method is intended to ensure, inter alia, the profile retention respectively the ability of the resist structures to maintain precise dimensions. According to the invention vinyl phenol-vinyl silane copolymers are used as resist materials.
REFERENCES:
patent: 3125554 (1964-03-01), Cooper et al.
patent: 4481049 (1984-11-01), Reichmanis et al.
patent: 4521274 (1985-06-01), Reichmanis et al.
Buiguez et al., "A New Positive Optical Resist for Bilayer Resist Systems", in Heuberger et al., eds. Microcircuit Engineering 84, Academic Press, Inc., 1985.
Wilkins, Jr. et al., "An Organosilicon Resin for Multilevel Resist Applications", J. Vac. Sci. Technol. B3, 306, (1985).
Saotome et al., "A Silicon Containing Positive Photoresist (SIPR) for a Bilayer Resist", J. Electrochem. Soc., 132, 909, (1985).
Birkle Siegfried
Feucht Hans-Dieter
Leuschner Rainer
Sezi Recai
Powell William A.
Siemens Aktiengesellschaft
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