ESD protection circuit located under protected bonding pad

Details ESD protection circuit located under protected bonding pad ESD protection circuit located under protected bonding pad

1997-04-29

1998-11-17

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

257126, 257128, 257173, 257174, 361 57, 361 91, 361100, H01L 2362, H01L 2974, H02N 300, H02N 320

Patent

active

058380434

ABSTRACT:
A circuit for protecting a bonding pad of a semiconductor device from ESD voltages is located under the pad to permit the space otherwise used for a protection circuit to be used for normal operating components. The protection circuit has a compact layout that provides maximum ability to handle an ESD current within this limited space. The semiconductor structure for the circuit has separate parts for two SCR circuits, one for each polarity of ESD current. Each SCR circuit comprises two symmetrical SCR structures.

REFERENCES:
patent: 4733285 (1988-03-01), Ishioka et al.
patent: 4803541 (1989-02-01), Kouda
patent: 4806999 (1989-02-01), Strauss
patent: 5182220 (1993-01-01), Ker et al.
patent: 5359211 (1994-10-01), Croft
patent: 5473169 (1995-12-01), Ker et al.

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