Method and apparatus for priority based scheduling of wafer proc

Details Method and apparatus for priority based scheduling of wafer proc Method and apparatus for priority based scheduling of wafer proc

1996-10-21

1999-07-27

Graybill, David

Metal working

Barrier layer or semiconductor device making

438908, H01L 2177, H01L 2102

Patent

active

059283890

ABSTRACT:
Apparatus and concomitant method for performing priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing system (cluster tool). The sequencer assigns priority values to the chambers in a cluster tool, then moves wafers from chamber to chamber in accordance with the assigned priorities. The sequencer is capable of determining the amount of time available before a priority move is to be performed and, if time is sufficient, the sequencer performs a non-priority move while waiting. The sequencer also dynamically varies assigned priorities depending upon the availability of chambers in the tool. Lastly, the sequencer prioritizes the chambers based upon the minimum time required for the robot to move the wafers in a particular stage.

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patent: 5024570 (1991-06-01), Kiresko et al.
patent: 5375061 (1994-12-01), Hara et al.
patent: 5402350 (1995-03-01), Kline

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