No thermal cure dry film solder mask

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430287, 430 18, 430910, 522 96, 525293, G03C 171, C08F26502

Patent

active

047176431

ABSTRACT:
Disclosed are dry film solder mask compositions containing a binder material that is the reaction product of: (a) a polymerized mixture of polypropyleneglycol monomethacrylate, methacrylic acid and, preferably, specific acrylates and methacrylates; and (b) isocyanatoethyl methacrylate. The masks are equal or superior to current dry film masks in affording protection to circuit boards.

REFERENCES:
patent: 2760863 (1956-08-01), Plambeck, Jr.
patent: 3694415 (1972-09-01), Honda et al.
patent: 3984244 (1976-10-01), Collier et al.
patent: 4006270 (1977-02-01), Morgan
patent: 4233425 (1980-11-01), Tefertiller et al.
patent: 4333963 (1982-06-01), Emmons et al.
patent: 4515887 (1985-05-01), Davis

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