Sodium permanganate etch baths containing a co-ion for permangan

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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134 2217, 134 27, 134 29, 156644, 156645, 156668, 156902, 252 795, 252156, 427307, B44C 122, B29C 1708, C03C 1500, C03C 2506

Patent

active

046017844

ABSTRACT:
Aqueous, alkaline liquid NaMnO.sub.4 solutions are provided which provide excellent resin desmearing and etchback, especially in the manufacture of printed circuit boards. The solutions comprise water, alkali metal hydroxide, NaMnO.sub.4 and from about 0.1 to about 3.0 moles per mole of MnO.sub.4.sup.- of a co-ion for MnO.sub.4.sup.- selected from the group consisting of K.sup.+, Cs.sup.+, Rb.sup.+ and mixtures thereof.

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