Method for transfer molding encapsulation of a semiconductor die

Details Method for transfer molding encapsulation of a semiconductor die Method for transfer molding encapsulation of a semiconductor die

1997-02-25

1999-12-14

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

26427217, H01L 2156

Patent

active

060016728

ABSTRACT:
A process for manufacturing semiconductor device including a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First, the dam prevents damage to the mold. Second, the dam prevents encapsulant packaging compound material from flowing onto the heat sink. The dam may be a gasket. The dam may also be a burr created by, for example, stamping the bottom of the heat sink. The dam may include copper, polyamides, and leadlock tape. The dam may be permanently connected to the heat sink or removed following packaging. The dam may be removed mechanically, through the use of heat, or during an electrolytic deflash cycle.

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