4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Richard W. Wensel

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Apparatus for removing contaminants on electronic devices

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate

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Carrier substrate and carrier assembly using residual...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Chip-on-board assemblies, carrier assemblies and carrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Dam structure for center-bonded chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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De-wetting material for glob top applications

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Profile ID: LFUS-PAI-P-206646

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