Photosensitive resin composition

Details Photosensitive resin composition Photosensitive resin composition

1998-03-30

1999-12-14

Baxter, Janet

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

522 99, 522148, 522149, G03C 1725

Patent

active

060015349

ABSTRACT:
A photosensitive resin composition is comprised of (A) a polyimide resin having a weight-average molecular weight of from 5,000 to 150,000, represented by the general formula (I): ##STR1## wherein X is a specified tetravalent organic group having two benzene rings, Y is a member comprised of 30-100 mol % of a specific organic group having two benzene rings and 70-0 mol % of another specific divalent aromatic organic group, Z is a divalent organic group represented by the general formula (VI): ##STR2## wherein b is an integer of 5 to 80; and m and n each represent a number satisfying that m/(m+n) is 0.98 to 0.70 and n/(m+n) is 0.02 to 0.30; (B) an agent selected from a sensitizer and a photopolymerization initiator; and (C) an organic solvent. From this composition, polyimide films having a superior adhesion to substrates and also having no corrosive properties can be formed by low-temperature heat treatment.

REFERENCES:
patent: 4778859 (1988-10-01), Ai et al.
patent: 5616448 (1997-04-01), Kato
patent: 5866627 (1999-02-01), Czornyj et al.

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