Plastic and nonmetallic article shaping or treating: processes – With step of making mold or mold shaping – per se
Patent
1998-03-12
1999-08-03
Davis, Robert
Plastic and nonmetallic article shaping or treating: processes
With step of making mold or mold shaping, per se
26427217, 425116, 425544, 425588, B29C 4502, B29C 4514
Patent
active
059321601
ABSTRACT:
A mold set for encapsulating semiconductor chips on lead frame strips with a molding compound supplied in tablets, includes a pot where molding compound tablets are loaded and pressed to form a fluid molding compound (FMC), and a main runner connected to the pot, through which the FMC passes from the pot. A plurality of sub-runners are connected to the main runner and are oriented substantially radially from a center region of the main runner. Each sub-runner has a proximal end, where it joins the main runner, and a distal end. A plurality of cavities are disposed on both sides of the main runner. Each of the plurality of cavities is in flow to communication with the distal end of a respective one of the plurality of sub-runners. The present invention allows the FMC to be introduced into all cavities at nearly the same time and at nearly a constant velocity.
REFERENCES:
patent: 4909725 (1990-03-01), Ward
patent: 4915608 (1990-04-01), Tsutsumi et al.
patent: 5071334 (1991-12-01), Obara
patent: 5741530 (1998-04-01), Tsunoda
Davis Robert
Samsung Electronics Co,. Ltd.
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