Semiconductor wafer processing apparatus

Details Semiconductor wafer processing apparatus Semiconductor wafer processing apparatus

1993-09-27

1995-02-28

Bueker, Richard

Coating apparatus

Gas or vapor deposition

With treating means

118728, 118500, C23C 1600

Patent

active

053933494

ABSTRACT:
The present invention relates to semiconductor wafers which have a through hole formed at their center portion. A processing apparatus provided with a conveyor means including a wafer holder having a holding protrusion which engages with this through hole implements oxidation and dispersion processing or CVD processing to a processing surface of a semiconductor wafer so that a semiconductor wafer can have heat treatment performed without accompanying film growth faults or heat distortion.

REFERENCES:
patent: 2890976 (1959-07-01), Lehovec
patent: 4733631 (1988-03-01), Boyarsky
patent: 5148714 (1992-09-01), McDiarmid
E. Bassous et al., "Fabrication of Dense Arrays of Hozzles and Channels with High Degree of Precision", IBM Technical Disclosure Bulletin, vol. 19 (Nov. 1976) pp. 2243-2246.
R. A. Leone, et al., "Fabricating Shaped Grid and Aperture Holes", IBM Technical Disclosure Bulletin, vol. 14 (Jul. 1971) pp. 417-418.

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