Method for manufacture of multilayer printed circuit boards

Details Method for manufacture of multilayer printed circuit boards Method for manufacture of multilayer printed circuit boards

1988-08-01

1990-05-01

Dees, Jose

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430316, 430317, 430319, 430394, 204 15, G03C 516

Patent

active

049217771

ABSTRACT:
This method relates to a process for manufacturing printed circuit boards in which a metal coating is sputtered onto certain regions of a substrate. Adhesion of the sputtered material is excellent. Surface preparation of the substrate and etching thereof prior to sputtering are virtually eliminated. Films deposited by sputtering exhibit uniform coverage and thickness.

REFERENCES:
patent: 4211603 (1980-07-01), Reed
patent: 4528259 (1985-07-01), Sullivan
patent: 4582778 (1986-04-01), Sullivan
patent: 4795693 (1989-01-01), Ors et al.

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