Stack module

Details Stack module Stack module

1997-04-18

1999-03-16

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257713, 257723, H01L 2302

Patent

active

058834265

ABSTRACT:
A stack module is provided which relieves thermal stress generated in a heat-radiating element and provides improved cooling efficiency. Connection bumps of a plurality of mounting substrates, onto which are mounted semiconductor chips are used to stack the substrates to four levels, three wave-shaped heat-radiating elements, made of copper, being in thermal contact between the semiconductor chips of three of the mounting substrates and the rear surfaces of three of the mounting substrates, making use of the spring elasticity of the heat-radiating elements to establish this thermal contact.

REFERENCES:
patent: 5528456 (1996-06-01), Takahashi
Nobuaki Takahashi et al., "3-Dimensional Memory Module", NEC Corporation, Japan, pp. 1-7.

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