Semiconductor device with particular silicide structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257413, 257384, H01L 2976, H01L 2994, H01L 31062

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active

058834184

ABSTRACT:
A silicide layer having a two-layer structure or a silicide layer made of material having high etching selectivity is formed on a silicon layer constituting a gate electrode, causing the silicide layer to serve as an etching stopper at the time of forming a contact hole. Furthermore, a top surface of an insulating layer in which a contact hole is formed is planarized by a CMP method, facilitating subsequent formation of an interconnection or the like. In addition, when a silicide layer consisting of two layers is formed on the gate electrode, each of those two layers can be made of either the same material or materials different from each other. Thus, even if contact holes extending to the gate electrode and source/drain regions are simultaneously formed in the planarized insulating layer, lower layers of the gate electrode and the source/drain regions will not be etched, resulting in a semiconductor device in which an interconnection on the insulating layer can be formed easily.

REFERENCES:
patent: 4886764 (1989-12-01), Miller et al.
patent: 4914500 (1990-04-01), Liu et al.
patent: 5027185 (1991-06-01), Liauh
patent: 5219788 (1993-06-01), Abernathey et al.
patent: 5221853 (1993-06-01), Joshi et al.
Chih-Shih Wei et al, Formation of Self-Aligned TiN/CoSi2 Bilayer from Co/Ti/Si and It's applications in Salicide, Diffusion Barrier and Contact Fill, Intel Corporation, VMIC Conference, IEEE, p. 232-239, Jun. 1990.
C.Y. Ting et al, The Use of TISI.sub.2 for Self Aligned Silicide (Salicide) Technology, IBM Thomas J. Watson Research Center, V-MIC Conference, IEEE, pp. 307-318, Jun. 1985.
M. Lawrence et al, Growth of Epitaxial CoSi.sub.2 on (100) Si, Intel Corporation, American Institute of Physics, Appl. Phys. Lett. vol. 58, No. 12, pp. 1308-1311, Mar. 1991.

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