Semiconductor device having a capacitor formed on a surface of a

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

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257704, 257795, 257924, 361811, 361820, H01L 2306, H01L 2310, H01L 2315

Patent

active

058181067

ABSTRACT:
A semiconductor device which includes a ceramic package main body, a semiconductor element and a closure for sealing the semiconductor element in the package. A capacitor is formed on an upper or lower surface of the closure. The capacitor has a dielectric film interposed between a pair of electrode films. The dielectric film includes a ceramic filler and an amorphous glass. The closure and the package main body are sealed. A terminal formed in the package main body and the electrode film of the capacitor are connected electrically. High-density packaging on a substrate can be achieved. High strength of the closure itself can be maintained. Thermal stress developed in the closure itself, or the conjugated portion between the closure and the package main body, can be suppressed. Reliability of a sealed structure in the semiconductor device for a long period of time can be increased.

REFERENCES:
patent: 4654694 (1987-03-01), Val
patent: 4743302 (1988-05-01), Dumesnil et al.
patent: 4827082 (1989-05-01), Horiuchi et al.
patent: 5047374 (1991-09-01), Nicholson et al.
patent: 5162062 (1992-11-01), Carroll et al.
patent: 5334558 (1994-08-01), Dietz et al.

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