Process and apparatus for depositing coatings of high electrical

Details Process and apparatus for depositing coatings of high electrical Process and apparatus for depositing coatings of high electrical

1987-06-08

1991-01-29

Nguyen, Nam X.

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419221, 20429806, 20429807, 20429811, C23C 1434

Patent

active

049884220

ABSTRACT:
Apparatus for reactive sputtering of an electrically resistive coating onto a planar substrate includes a magnetron cathode with a planar target of a metal which forms one component of the coating. The reaction gas, which provides another component of the coating, is released as close as possible to the target, but outside of its outline. The distance "a" between the target surface and the substrate surface is less than 60 mm, and a mask system is provided at a distance "d" from the substrate which is less than half the distance "a". The density of reaction gas particles in front of the substrate is thus increased, resulting in a high deposition rate.

REFERENCES:
patent: 4094764 (1978-06-01), Boucher et al.
patent: 4278528 (1981-07-01), Kuehnle et al.
patent: 4392931 (1983-07-01), Maniv et al.
patent: 4428809 (1984-01-01), Heimbach et al.
patent: 4572842 (1986-02-01), Dietrich et al.

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