Thermal gas cracking source technology

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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118723HC, 118724, 134 11, 134105, C23C 1400

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active

056931735

ABSTRACT:
An atomic hydrogen source. The source has an elongated cylindrical structure with proximal and distal or inner and outer ends. A head structure is disposed at the proximal end for communicative connection with electrical power, gas, temperature control and related systems. A mounting flange is disposed along the length of the source for connection with an MBE or other apparatus. A tube structure is disposed at the distal end for extension into the apparatus. The tube structure includes gas and power conduction elements, including a high temperature resistive filament for cracking gas.

REFERENCES:
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Kurado et al., "Selective Growth of InGaAs-InP Layers by Gas Source Molecular Beam Epitaxy with Atomic Hydrogen Irradiation", Japanese Journal of Applies Physics, vol. 32, Part 2, No. 11A, Nov. 1, 1993.
Chun et al., "Low Temperature Surface Cleaning of InP by Irradiation of Atomic Hydrogen", Japanese Journal of Applied Physics, vol. 32, Part 2, No. 2B, Feb., 1993, L287-L289.
Kao et al., "Effects of Atomic Hydrogen On Impurity Reduction in MOMBE-Grown GaAs", Mal. Res. Soc. Symp. Proc., vol. 145, 1989 Materials Research Society, 57-61.
Okada et. al., "High-Quality GaAs Films on Si Substrates Grown by Atomic Hydrogen-Assisted Molecular Beam Epitaxy for Solar Cell Applications", Japanese Journal of Applied Physics, vol. 32, Part 2, No. |0B, Oct. 15, 1993, L1556-L1558.

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