Process for making studless thin film magnetic head

Details Process for making studless thin film magnetic head Process for making studless thin film magnetic head

1992-07-21

1994-07-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156643, 156656, 1566591, 1566611, 156667, B44C 122, C23F 100

Patent

active

053264290

ABSTRACT:
A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and a dilute (1:2) HF in water etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer to expose the bonding pads. The method also enables the etching of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations Similarly, pattern-etching of the alumina undercoat facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.

REFERENCES:
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patent: 4190871 (1980-02-01), Walraven
patent: 4190872 (1980-02-01), Jones, Jr. et al.
patent: 4219853 (1980-08-01), Albert et al.
patent: 4315291 (1982-02-01), Lazzari
patent: 4592801 (1986-06-01), Hara et al.
patent: 4652954 (1987-03-01), Church
patent: 4791719 (1988-12-01), Kobayashi et al.
patent: 5059278 (1991-10-01), Cohen et al.
J. Khan et al., "Applications of Laser Etching In Thin Film Head Fabrication", Extended Abstracts, The Electrochemical Society, Fall Meeting, Hollywood, Florida, Oct. 1989, pp. 438-439.

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