Semiconductor device with a foil-sealed lid

Details Semiconductor device with a foil-sealed lid Semiconductor device with a foil-sealed lid

1993-08-17

1996-05-28

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257678, 257704, 257710, 257774, H01L 2302, H01L 2312, H01L 2316

Patent

active

055214363

ABSTRACT:
A semiconductor device includes a semiconductor substrate forming the bottom portion of a package of the device and a ceramic plate forming the upper or lid portion of the device. The substrate includes a layer of metal on its upper surface along the substrate outer edge and spaced apart from electrodes on the substrate upper surface. The ceramic plate includes a copper foil on its lower surface along the outer edge thereof which overlaps and is bonded to the substrate metal layer. The ceramic plate has apertures therethrough which are sealed by copper foils on the inside of the package, the foils being bonded to respective ones of the substrate electrodes.

REFERENCES:
patent: 3059158 (1962-10-01), Doucette et al.
patent: 3116443 (1963-12-01), Forster et al.
patent: 4249034 (1981-02-01), Fichot et al.
patent: 4626960 (1986-12-01), Hammano et al.
patent: 4646129 (1987-02-01), Yerman et al.
patent: 5135890 (1992-08-01), Temple et al.
patent: 5248901 (1993-09-01), Temple

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