Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-12-15
1994-03-29
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156656, 156657, 1566591, 156662, 156665, 156668, 156345, 252 791, H01L 21306, B44C 122, C23F 100, B29C 3700
Patent
active
052981126
ABSTRACT:
A method and apparatus for removing a composite attached to a material to be treated by dry ashing using a gas including a halogen element and a gas including a hydrogen element or using a gas including fluorine, a gas including oxygen and a gas including chlorine in a reaction chamber containing the material therein for use in manufacturing a semiconductor device.
REFERENCES:
patent: 4734152 (1988-03-01), Geis et al.
patent: 4749440 (1988-06-01), Blackwood et al.
patent: 4818327 (1989-04-01), Davis et al.
Patent Abstracts of Japan 58-137836, Aug. 16, 1983.
Patent Abstracts of Japan, 60-106132, Jun. 11, 1985.
Patent Abstracts of Japan, 60-53023 Mar. 26, 1985.
S. K. Ghandi V.L.S.I. Fabrication Principles, 1983 John Wiley & Sons, Inc. New York pp. 502 & 503.
Arikado Tsunetoshi
Hayasaka Nobuo
Horioka Keiji
Okano Haruo
Kabushiki Kaisha Toshiba
Powell William A.
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