Method for removing composite attached to material by dry etchin

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156656, 156657, 1566591, 156662, 156665, 156668, 156345, 252 791, H01L 21306, B44C 122, C23F 100, B29C 3700

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052981126

ABSTRACT:
A method and apparatus for removing a composite attached to a material to be treated by dry ashing using a gas including a halogen element and a gas including a hydrogen element or using a gas including fluorine, a gas including oxygen and a gas including chlorine in a reaction chamber containing the material therein for use in manufacturing a semiconductor device.

REFERENCES:
patent: 4734152 (1988-03-01), Geis et al.
patent: 4749440 (1988-06-01), Blackwood et al.
patent: 4818327 (1989-04-01), Davis et al.
Patent Abstracts of Japan 58-137836, Aug. 16, 1983.
Patent Abstracts of Japan, 60-106132, Jun. 11, 1985.
Patent Abstracts of Japan, 60-53023 Mar. 26, 1985.
S. K. Ghandi V.L.S.I. Fabrication Principles, 1983 John Wiley & Sons, Inc. New York pp. 502 & 503.

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