Patent
1989-10-16
1990-11-13
Hille, Rolf
357 67, 357 69, H01L 2348, H01L 2354
Patent
active
049705709
ABSTRACT:
The present invention teaches a structure for reducing the stresses created on a substrate and on the bonding surface at which a connector is attached. The connector has a tapered or beveled head thereby tapering the stress away from the edges of the bonding surface and therefore away from the high stress areas of the substrate, preventing cracking and delamination problems that might otherwise result. The tapered-head geometry also allows greater flexibility in manufacturing the connectors particularly when fabricating pins using a cold-heading process in that a quarter shank diameter:pin head diameter ratio can be obtained.
REFERENCES:
patent: 3449642 (1969-06-01), Ortner et al.
patent: 3457386 (1969-07-01), Costello
patent: 3522487 (1970-08-01), Hessinger
patent: 4070688 (1978-01-01), Wislocky
patent: 4418857 (1983-12-01), Ainslie et al.
patent: 4518112 (1985-05-01), Miller et al.
patent: 4634041 (1987-01-01), Prasad et al.
patent: 4672739 (1987-06-01), Churchwell et al.
IBM TDB vol. 25, No. 6, Nov. 1982, p. 2928, "Stress Diffusing Base For Connector Pins", VanVechten and VanGutfeld.
"Improvement of Metallization For Alumina Substrates", Shara et al, IEEE Electronic Components Conference Proceedings, May 1982, p. 32.
Agarwala Birendra N.
Palmateer Paul H.
Shih Da-Yuan
Ahsan Aziz M.
Clark S. V.
Hille Rolf
International Business Machines - Corporation
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