Epitaxial composite and method of making

Details Epitaxial composite and method of making Epitaxial composite and method of making

1978-04-07

1983-01-11

Smith, John D.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156610, 156611, 156612, 156613, 156614, 148 15, 148175, C30B 2502, C30B 2510, C30B 2518, H01L 21205

Patent

active

043680984

ABSTRACT:
An epitaxial composite comprising a thin film of single crystal Group III-V wide band-gap compound semiconductor or semiconductor alloy on single crystal, electrically insulating oxide substrates such as sapphire, spinel, BeO, ThO.sub.2, or the like, and on III-V semiconductors or alloys. The thin film may be produced in situ on a heated substrate by reaction of an organic compound containing the Group III constituent, typically the alkyl metal organic, such as trimethylgallium and/or triethylgallium with a Group V hydride such as arsine, phosphine and/or stibine.

REFERENCES:
patent: 3146137 (1964-08-01), Williams
patent: 3218205 (1965-11-01), Ruehrweir
patent: 3417301 (1968-12-01), Galli
patent: 3424955 (1969-01-01), Seiter
patent: 3433684 (1969-03-01), Zorowick
patent: 3433686 (1969-03-01), Marinace
patent: 3462323 (1969-08-01), Grover
patent: 3476593 (1969-11-01), Lehrer
patent: 3480472 (1969-11-01), Dersin
patent: 3508962 (1970-04-01), Manasevit
patent: 3674552 (1972-07-01), Heyweng
patent: 3830654 (1974-08-01), Cho
Handbook of Chemistry & Physics 42nd Ed. (1961-1962) Chem. Rubber Pub. Co. pp. 2681-2697, 2700-2710.

Affiliated with

Also associated with

Rating

Epitaxial composite and method of making does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epitaxial composite and method of making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epitaxial composite and method of making will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-777655