Reinforced plastics carrier for printed circuits

Paper making and fiber liberation – Processes and products – Mineral fiber

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1621681, 428413, 428417, 428428, 156 628, 1563077, 156330, D21H 518

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active

RE0311243

ABSTRACT:
Non-woven glass-fiber webs for reinforcing plastics material carrying printed circuits are produced by the wet process from E-glass fibers bonded with polyvinyl alcohol. The polyvinyl alcohol used is a powder or suspension, has a degree of hydrolization of 98-100%, and a viscosity, as a 4% solution in water of 20.degree. C., of 20-100 cP. Preferably the polyvinyl alcohol has a degree of swelling at 20.degree. C. of between 3 and 8, and in the dry form a particle size of between 50 and 180.mu.. A plurality of these glass fiber webs are impregnated with a solution of an epoxy resin, arranged as a laminate, then compressed at elevated pressure and temperature to form the final laminate.

REFERENCES:
patent: 3012929 (1961-12-01), Jackson
patent: 3200104 (1965-08-01), Imai et al.
patent: 3544538 (1970-12-01), Masuda et al.
patent: 3556754 (1971-01-01), Marsden et al.
patent: 3582513 (1971-06-01), Bouchard et al.
patent: 3622445 (1971-11-01), Heidweiller
patent: 3630831 (1971-12-01), Jongetjes
Benzinger et al., "Properties of Glass Paper Laminates Made with Various Thermosetting Resins", Tappi, vol. 49, #10, p. 460-464, 10-66.
Cakin, J. B., "Modern Pulp & Paper Making", 3rd Ed., Reinhold Pub., NY, NY, 1957, pp. 312-313.

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