Method of making a laminated structure with shear force delamina

Details Method of making a laminated structure with shear force delamina Method of making a laminated structure with shear force delamina

1992-03-20

1995-01-17

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430315, 430318, 430323, 430324, 1566591, 156664, 156666, G03C 500

Patent

active

053825055

ABSTRACT:
The surface of a metal foil to be used as an intermediate layer in printed circuit boards is chemically roughened. In one embodiment, fine depressions are etched out of the metal coating. In another embodiment, protuberances are plated thereon. The use of the method permits the use of the foil in the production of multilayer printed circuit boards with coatings having different thermal expansion characteristics and improves the adhesion with the next conductor layer applied thereto to a significant extent and prevents delamination.

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patent: 4446188 (1984-05-01), Patel et al.
patent: 4456500 (1984-06-01), Ibata
patent: 4745795 (1988-07-01), Bakos et al.

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