Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1992-12-21
1995-07-25
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257692, 257693, 257675, 257735, 257773, 257782, 361760, 361767, 361772, H01L 2348, H01L 2302, H01L 2944
Patent
active
054365007
ABSTRACT:
A surface mount semiconductor package having a novel lead configuration which facilitates a higher packing density than presently available semiconductor packages. More particularly, the package includes a plurality of electrical leads each having a laterally outwardly extending portion, a downwardly extending portion depending from an inner distal end of the laterally extending portion, and a foot portion extending laterally inwardly from a lower distal end of the downwardly extending portion. A semiconductor chip is mounted, preferably by adhesive means such as insulating tape, to the foot portion of the leads. A plurality of electrical wires are connected between an upper surface of the chip and the laterally outwardly extending portion of respective ones of the leads. A protective body, such as a molded resin body, encapsulates the chip, the wires, the laterally outwardly and downwardly extending portions of the leads. The foot portion of each of the leads is at least partially disposed externally to the molded resin body to facilitate the mounting of the package to a printed circuit board (PCB) or other substrate.
REFERENCES:
patent: 3940786 (1976-02-01), Scheingold et al.
patent: 4539472 (1985-09-01), Poetker et al.
patent: 4937656 (1990-06-01), Kohara
patent: 5157480 (1992-10-01), McShane et al.
patent: 5224021 (1993-06-01), Takada et al.
Choi Jong K.
Park Jong Y.
Donohoe Charles R.
Hille Rolf
Samsung Electronics Co,. Ltd.
Wallace Valencia
Westerlund Robert A.
LandOfFree
Surface mount semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Surface mount semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface mount semiconductor package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-741617