Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-11-07
1998-01-20
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174252, 174257, 257675, 257707, 257738, 361717, 361718, 361764, H05K 103, H05K 504, H01L 23495
Patent
active
057106959
ABSTRACT:
A leadframe ball grid array package for packaging an integrated-circuit die includes a metallic substrate having a central portion and a leadflame having a plurality of inwardly-extending bonding fingers and a centrally-located open portion. The leadframe is directly attached to the metallic substrate by a non-conductive adhesive so that the open portion thereof overlies the central recessed portion of the metallic substrate. An integrated-circuit die is mounted in the central portion of the metallic substrate. The bonding fingers are disposed peripherally surrounding the integrated-circuit die. Bonding wires are interconnected between bonding pads formed on the integrated-circuit die and the plurality of bonding fingers. A solder mask is disposed over the top surface of the leadframe so as to form selective solderable areas. Solder balls are attached to the selective solderable areas. A plastic material or a lid is applied over the top surface of the die, bonding fingers and bonding wires.
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King Patrick T.
Sparks Donald
VLSI Technology Inc.
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