Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1991-12-10
1994-01-25
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257686, 257692, 257693, 257723, 437205, 437208, 437209, H01L 2302
Patent
active
052818527
ABSTRACT:
Leadframes from a TAB tape having die attached are curved so that the free ends of the leads curve back over themselves. A separator, attached to the die, defines a pocket for receiving the free end of the leads. The die and separator form a subassembly which is combined with other subassemblies to make the stack. Sides having an array of conductive contact areas connected in a predetermined pattern are placed against the edges of the die to touch the curved leads which form a resilient contact with the sides. A resilient member can be located within the curved leads to support the leads during assembly. In one embodiment, the leads are wrapped around the edges of the die itself. In other embodiments, the leads are wrapped around the edge of the separator.
REFERENCES:
patent: 4500905 (1985-02-01), Shibata
patent: 4553020 (1985-11-01), Val
patent: 4770640 (1988-09-01), Walter
patent: 4890154 (1989-12-01), Sahakian
patent: 4935005 (1990-05-01), Carlson et al.
patent: 4956694 (1990-09-01), Eide
patent: 4956695 (1990-09-01), Robinson et al.
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5016138 (1991-05-01), Woodman
patent: 5053852 (1991-10-01), Biswas et al.
Mintel William
Potter Roy
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