Sputter deposition with mobile collimator

Details Sputter deposition with mobile collimator Sputter deposition with mobile collimator

1994-02-01

1999-09-28

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419212, 20429803, 20429811, C23C 1434

Patent

active

059581930

ABSTRACT:
A sputter deposition system includes a mobile collimator. The collimator can be magnetically moved into and out of a position between a wafer and a target of material to be sputtered onto the wafer. In addition, magnets are used to levitate the collimator so that it can be removed without solid-solid friction, and the contamination it can cause. The magnets used for levitation are part of a control loop that maintains the orientation of the collimator parallel to the wafer. The system allows for a combination of good deposition step coverage and high fabrication throughput while minimizing opportunities for contamination and breakage that can occur when the wafer is transferred between chambers.

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