Integrated junction temperature sensor/package design and method

Details Integrated junction temperature sensor/package design and method Integrated junction temperature sensor/package design and method

1996-05-14

1998-11-03

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257713, 257467, 361719, 165 802, H01L 2334

Patent

active

058313338

ABSTRACT:
A structure and method for controlling the junction temperature of a semiconductor chip in an electronic system. A temperature sensing device and the chip whose junction temperature is to be monitored are located adjacent to one another on the same interconnect structure. A thermally conductive lid can also be attached to the interconnect structure, thereby enclosing the temperature sensing device and the chip within in a closed cavity. Dedicated pins extend from the temperature sensing device through the interconnect structure, for connection to a temperature control circuit. By locating the temperature sensing device on the same interconnect structure as the chip, and within a common enclosure, the temperature sensed by the temperature sensing device is an accurate representation of the actual junction temperature of the chip. By obtaining an improved reading of the actual junction temperature, the operation of the temperature control circuit can be optimized.

REFERENCES:
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patent: 4926227 (1990-05-01), Jensen
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patent: 5361188 (1994-11-01), Kondou et al.
patent: 5440520 (1995-08-01), Schutz et al.
patent: 5483102 (1996-01-01), Neal et al.
patent: 5569950 (1996-10-01), Lewis et al.

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