Method of making circuitry with bump contacts

Details Method of making circuitry with bump contacts Method of making circuitry with bump contacts

1978-01-30

1979-02-13

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

156644, 156666, 204 24, C25F 316, C25D 700, C25D 706

Patent

active

041394348

ABSTRACT:
A process for manufacturing a carrier for semiconductor devices such as integrated chips. The carrier conventionally comprises, on one surface, a lead circuit providing leads to the conduction pads of the semiconductor devices. The other side may be called a bump circuit and includes bonding pads or bumps to contact corresponding elements of the semiconductor devices. Small size bumps are made by applying the etching solution only to the lead circuit which has previously been coated with photoresist as well as the bump circuit. Eventually, the etching solution will run over the bump circuit, thereby to create bumps or pads without reducing the thickness of the lead circuit to less than about 2 mils thickness. The resulting carrier may then be polished and covered with a layer of nickel and a layer of gold.

REFERENCES:
patent: 3314869 (1967-04-01), Dobbin et al.
patent: 3325319 (1967-06-01), Frantzen
patent: 3329541 (1967-07-01), Mears
patent: 3519543 (1970-07-01), Gwyn, Jr.
patent: 3719567 (1973-03-01), Ono et al.
IBM Tech. Disclosure Bulletin, vol. 12, No. 4, Sep. 1969, p. 559.

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