Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Patent
1996-12-18
1998-09-29
Wilczewski, Mary
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
438164, 438303, 438655, 438682, 438657, 438586, 438595, 148DIG147, H01L 21336, H01L 21285
Patent
active
058145370
ABSTRACT:
A method is provided for forming silicide surfaces on source, drain, and gate electrodes in active devices to decrease the resistance of the electrode surfaces, without consuming the silicon of the electrodes in the process. Silicide is directionally deposited on the electrodes so that a greater thickness accumulates on electrode surfaces, and a lesser thickness accumulates on the gate sidewall surfaces isolating the gate from the source/drain electrodes. Then, the electrodes are isotropically etched so that the lesser thickness on the sidewalls is removed, leaving at least some thickness of silicide covering the electrodes. In further steps, the electrodes are masked with photoresist, and any silicide deposited in the region of field oxide around the electrodes is removed. Conductive lines, connecting to the electrodes across the field oxide, are fabricated from polycide, which includes a level of polysilicon covered with silicide, when the lower resistance surface of a metal-disilicide overlying the conductive line is required. The method of the present invention is applicable to bulk silicon, as well as SIMOX, transistor fabrication processes. An IC structure having different thicknesses of directionally deposited silicide, and a completed MOS transistor having interim thicknesses of directionally deposited silicide, are also provided.
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patent: 5529958 (1996-06-01), Yaoita
Hsu Sheng Teng
Maa Jer-shen
Maliszewski Gerald W.
Ripma David C.
Sharp Kabushiki Kaisha
Sharp Microelectronics Technology,Inc.
Wilczewski Mary
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