Mold having projections for inhibiting the formation of air pock

Details Mold having projections for inhibiting the formation of air pock Mold having projections for inhibiting the formation of air pock

1997-09-22

1999-04-27

Davis, Robert

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425544, 425572, 26427217, 26432812, B29C 4514, B29C 4526

Patent

active

058978836

ABSTRACT:
A mold for encapsulating semiconductor device packages provides improved reliability by reducing air traps in the encapsulant. The mold has an upper mold die and a lower mold die which together form a cavity where the package is encapsulated by the molding compound. Air traps are reduced by equipping the lower mold die with projections formed along edges of the cavity extending in the direction of the molding compound flow. The mold allows a reduction of the formation air traps around or at the positions where the lead frame and chip are located so that the reliability of the resulting package is improved.

REFERENCES:
patent: 5214846 (1993-06-01), Asami et al.
patent: 5686038 (1997-11-01), Christensen et al.

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