Catalytic acceleration and electrical bias control of CMP proces

Details Catalytic acceleration and electrical bias control of CMP proces Catalytic acceleration and electrical bias control of CMP proces

1999-04-27

2000-02-29

Utech, Benjamin

Abrasive tool making process, material, or composition

With inorganic material

Metal or metal oxide

252 791, B24D 302

Patent

active

060304251

ABSTRACT:
A slurry for chemical-mechanical polishing comprises a high pH solution with particles of a catalyst mixed with the high pH solution for accelerating the polishing rate. The catalyst preferably is a metal selected from the group consisting of platinum, silver, palladium, copper, rhodium, nickel, and iron. The catalyst may be impregnated into a polishing pad used to apply the slurry to a surface. A CMP process for metal surfaces includes applying a slurry to a metal surface to be polished, and providing an electrical bias to the workpiece and to the slurry for controlling the polishing rate. The electrical bias is provided to dies in the workpiece by means of an electrical connection between a bias voltage source and scribe lines between adjacent dies. CATALYTIC ACCELERATION AND ELECTRICAL BIAS CONTROL OF CMP PROCESSING

REFERENCES:
patent: 5352277 (1994-10-01), Sasaki
patent: 5922091 (1999-07-01), Tsai et al.
patent: 5934978 (1999-08-01), Burke et al.

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