Micro-scale part positioning by surface interlocking

Details Micro-scale part positioning by surface interlocking Micro-scale part positioning by surface interlocking

1997-02-06

2000-02-29

Ryan, Patrick

Metal fusion bonding

Process

Using high frequency vibratory energy

228119, 228 29, H01L 2100

Patent

active

060298812

ABSTRACT:
A principle of surface interlocking wherein the imperfections of two parallel surfaces deform and interlock under pressure. The surface interlocking enables the combination of a bridging element and a bonding tip of a diffusion bonding apparatus to pick up, transport, position at a unique location, and bond the bridging element in place to the conductors or pads. In the invention a single point bonding tip as part of a bonding apparatus is used to pick up the, to be, bridging metal object transport it to the bonding site and perform the entire bridging bonding operation all in one sequence of steps.

REFERENCES:
patent: 5079070 (1992-01-01), Chalco et al.
patent: 5193732 (1993-03-01), Interrante et al.
patent: 5289632 (1994-03-01), Chalco et al.
"Replacement of Missing Solder Balls by Transient Wetting Transfer" IBM Technical Disclosure Bulletin vol. No. Pages.
Copending Patent Application Ser. No. Filed Apr. 29, 1996 (IBM Docket No. Y0995-053) "TFT/LCD Active Data Line Repair"-Inventors Alt et al.

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