Process for mounting a semiconductor chip and depositing contact

Details Process for mounting a semiconductor chip and depositing contact Process for mounting a semiconductor chip and depositing contact

1993-07-23

1995-04-18

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437209, 257698, 257778, 257783, 361767, H01L 21283, H01L 2158, H01L, H01L

Patent

active

054078644

ABSTRACT:
A process of manufacturing a semiconductor chip that has a connecting pad and is connected to a front side of a circuit board that has a conductive trace connected to a through-hole. An insulating adhesive layer, which has a hole corresponding to the pad, is interposed between the chip and the board so that the pad, the hole in the insulating layer and the through-hole in the board are aligned. A conductive material is applied into the through-hole from the back side of the board so as to fill the through-hole and connect the pad to the trace. The conductive material may be applied using a sputtering method, a screening method, an electroplating method or an evaporating method. The back side of the board is polished to remove conductive material which may have been applied on the back side of the board outside the through-hole.

REFERENCES:
patent: 4754371 (1988-06-01), Nitta et al.
patent: 4879258 (1989-11-01), Fisher
patent: 4918811 (1990-04-01), Eichelberger et al.
patent: 5111279 (1992-05-01), Pasch et al.
patent: 5157589 (1992-10-01), Cole, Jr. et al.
patent: 5171712 (1992-12-01), Wang et al.
"LSI Package Design", IBM Technical Disclosure Bulletin; vol. 32, No. 8A, Jan. 1990, pp. 178 & 179.

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