Semiconductor device with test-only contacts and method for maki

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

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257692, 257737, 257778, 257786, H01L 2302

Patent

active

053348575

ABSTRACT:
A semiconductor device has test-only contacts to reduce the size of the device and eliminate unnecessary external contacts. In one form of the invention, a semiconductor device (30) is provided with solder balls (26) which are electrically coupled to those portions of a semiconductor die (20) that are necessary for device operation. The device also includes test pads (32) formed on a package substrate (12) which are electrically coupled to those portions of the die which are necessary only for a manufacturer's testing purposes. In another form, a semiconductor device (10) includes external test-only solder balls along the periphery of the package substrate, for example solder balls between boundaries A and B. After testing is complete, the package substrate is excised along boundary A, thereby eliminating solder balls which are not needed by the device user. A combination of the two techniques may also be used.

REFERENCES:
patent: 4437141 (1984-03-01), Prokop
patent: 4437141 (1984-03-01), Prokop
patent: 4881029 (1989-11-01), Kawamura
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5065227 (1991-11-01), Frankeny et al.
Semiconductor Wafer Testing, D. E. Shultis, Dec. 1970, IBM Technical Disclosure Bulletin vol. 13 No. 7 p. 1793.

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