Semiconductor device face-down bonded with pillars

Details Semiconductor device face-down bonded with pillars Semiconductor device face-down bonded with pillars

1997-08-20

2000-08-01

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257680, 257659, 257664, 257788, 257737, 257738, 257691, 257698, 174 522, H01L 23495, H01L 2302, H01L 2348, H01L 2328

Patent

active

060970979

ABSTRACT:
A face-down-bonded semiconductor device having: a semiconductor substrate having a semiconductor electric/electronic circuit formed on the surface of the semiconductor substrate, the circuit having contact terminals; wiring pillars made of conductive material and disposed on the contact terminals on the surface of the semiconductor substrate; and support pillars disposed at positions different from the contact terminals on the surface of the semiconductor substrate, the support pillars each having a top surface generally at the same height as the height of each of the wiring pillars. The face-down-bonded semiconductor device can provide a sufficient support force and prevent degradation of the electrical characteristics.

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