Method for making thin film orthogonal microsensor for air flow

Details Method for making thin film orthogonal microsensor for air flow Method for making thin film orthogonal microsensor for air flow

1989-04-24

1990-01-23

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156653, 156656, 156657, 1566591, 156662, 156665, 20419223, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

048956163

ABSTRACT:
A microbridge air flow sensor which has a sealed etched cavity beneath the silicon nitride diaphragm so that the cavity is not susceptible to contamination from residual films or other material accumulating within the cavity. The cavity thermally isolates the heater and detectors which are encapsulated in the diaphragm. The cavity is fabricated by front side etching of the silicon wafer. Narrow slots are made through the silicon nitride diaphragm to expose a thin film (400 angstrom) rectangle of aluminum. A first etch removes the aluminum leaving a 400 angstrom very shallow cavity under the diaphragm. Anisotropic etch is then introduced into the shallow cavity to etch the silicon pit.

REFERENCES:
patent: 4472239 (1984-09-01), Johnson et al.
patent: 4581928 (1986-04-01), Johnson
patent: 4706061 (1987-11-01), Johnson

Affiliated with

Also associated with

Rating

Method for making thin film orthogonal microsensor for air flow does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making thin film orthogonal microsensor for air flow, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making thin film orthogonal microsensor for air flow will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-644027