Method for applying process solution to substrates

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437229, 427421, H01L 2130

Patent

active

054160472

ABSTRACT:
A substrate solution-processing method comprising the steps of preparing a pair of spin chucks by which semiconductor wafers are supported, a housing by which the wafers supported by the spin chucks are enclosed, motor for rotating the spin chucks, a nozzle through which developing or resist solution is applied to each wafer, means for moving the nozzle between the wafers, and a waiting trench at which the nozzle is kept waiting, setting substantially same the times needed to finish the cycles of processing the wafers supported on at least two spin chucks and delaying one process cycle from the other, and keeping the nozzle waiting at the waiting trench unless developing or resist solution is applied to each wafer through the nozzle.

REFERENCES:
patent: 3904339 (1975-09-01), Dunn
patent: 4158343 (1979-06-01), Nord
patent: 4190015 (1980-02-01), Hillman
patent: 4416213 (1983-11-01), Sakiya
patent: 4889069 (1989-12-01), Kawakami
patent: 4941426 (1990-07-01), Sago et al.
patent: 4989345 (1991-02-01), Gill, Jr.
patent: 5002008 (1991-03-01), Ushijima et al.
patent: 5061144 (1991-10-01), Akimoto et al.
patent: 5089305 (1992-02-01), Ushijima et al.
patent: 5095848 (1992-03-01), Ikeno

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for applying process solution to substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for applying process solution to substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for applying process solution to substrates will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-637569

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.