Substrate support having improved heat transfer

Details Substrate support having improved heat transfer Substrate support having improved heat transfer

1994-09-01

1998-04-14

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118724, 118728, 279128, 361234, 165 801, B25B 1100

Patent

active

057387516

ABSTRACT:
A substrate support member includes a pedestal and conductive member. The conductive member is cooled by the passage of a coolant therethrough, and a heat transfer enhancing fluid is flowed into the interface between the pedestal and the conductive member to increase the heat transfer from the pedestal to the conductive member.

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patent: 5382311 (1995-01-01), Ishikawa et al.

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