Plastic encapsulant for semiconductor

Details Plastic encapsulant for semiconductor Plastic encapsulant for semiconductor

1989-08-02

1990-05-15

Hille, Rolf

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525481, 525487, 528 27, H01L 2328, C08F28300, C08G 7704

Patent

active

049262394

ABSTRACT:
A plastic encapsulant for a semiconductor chip comprises an epoxy resin, an organosilicon compound, a hardener, a pigment, and an organic solvent. The epoxy resin is an epichlorohydrin-bisphenol A type epoxy resin, and the organosilicon compound is an organosilicon compound with a methoxy group, preferably, three methoxy groups. The hardener is a resol type phenol resin hardener. The organic solvent is a mixture of ketones, alcohols, and aromatic hydrocarbons.

REFERENCES:
patent: 4287326 (1981-09-01), Mikami
patent: 4327369 (1982-04-01), Kaplan
patent: 4367318 (1983-01-01), Ishimura et al.
Lee and Neville, Handbook of Epoxy Resins, McGraw Hill, .COPYRGT.1967, pp. 1-2, 25, of Chap. 24, Gr. 143, TP1180.E6 L4 C.6.

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