Etching of multiple holes of uniform size

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156654, H01L 21306

Patent

active

042395860

ABSTRACT:
Uniform holes with a diameter of the order of 1 micrometer or larger can be formed by an etching operation which employs the combination properties of the surface tension of the etch coupled with a force on the meniscus of the etch in the hole to cause the etching to stop when one hole reaches the proper size and to permit the etching to continue on all other holes until they reach the same size.

REFERENCES:
patent: 3645811 (1972-02-01), Davies et al.
patent: 3666579 (1972-05-01), Dietch
patent: 3724066 (1973-04-01), Wainer et al.
patent: 3770533 (1973-11-01), Zwicker
patent: 3921916 (1975-11-01), Bassous
patent: 4007464 (1977-02-01), Bassous et al.
patent: 4021278 (1977-05-01), Hood et al.
patent: 4066491 (1978-01-01), Ruh et al.
patent: 4155775 (1979-05-01), Alpaugh et al.
Brunsch et al., "Etching . . .-Hales", IBM Technical Disclosure Bulletin, vol. 19, No. 8, (1/77), pp. 3085-3086.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Etching of multiple holes of uniform size does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Etching of multiple holes of uniform size, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Etching of multiple holes of uniform size will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-606450

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.