Method of fabricating semiconductor devices and integrated circu

Fishing – trapping – and vermin destroying

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437 44, 437239, H01L 2131, H01L 21335

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055739652

ABSTRACT:
The base layer of high quality spacers, such as those used on the sidewalls of the gate stack of submicron devices (e.g., MOSFETs, EPROMs), are formed as composite, multi-layered structures of silicon oxides or of silicon oxides and silicon nitride.

REFERENCES:
patent: 4038107 (1977-07-01), Marr et al.
patent: 4638347 (1987-01-01), Iyer
patent: 4697199 (1987-09-01), De Graaf et al.
patent: 4735680 (1988-04-01), Yen
patent: 4764477 (1988-08-01), Chang et al.
patent: 4818714 (1989-04-01), Haskell
patent: 4843023 (1989-06-01), Chiu et al.
patent: 4851730 (1989-07-01), Doklan et al.
patent: 4853352 (1989-08-01), Newkirk et al.
patent: 4981810 (1991-01-01), Fazan et al.
patent: 5183770 (1993-02-01), Ayukawa et al.
patent: 5221632 (1993-06-01), Kurimoto et al.
patent: 5256586 (1993-10-01), Choi et al.
Wolf. S., Silicon Processing, vol. 2, 1990, Lattice Press, pp. 600-609, 628-631.
M. Orlowski et al., IEDM, "Submicron Short Channel Effects Due Gate Reoxidation Induced Lateral Interstitial Diffusion" pp. 632-635, 1987, Proceedings of the IEDM.
Parrillo, Louis C. et al, IEEE Transactions on Electron Devices 38 (1991) Jan. No. 1, pp. 39-46, "Disposable Polysilicon LDD Spacer Technology".
Roy, Pradip K. et al., AT&T Technical Journal, Nov./Dec. No. 6 (1988), pp. 155-174, "Synthesis of High-Quality Ultra-Thin Gate Oxides for ULSI Applications".
Wong, Catherine Y. et al, IEEE Electron Device Letters, Sep. 1989, No. 9, pp. 420-422, "Sidewall Oxidation of Polycrystalline-Silicon Gate".

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