Encapsulation filler technology for molding active electronics c

Details Encapsulation filler technology for molding active electronics c Encapsulation filler technology for molding active electronics c

1995-09-25

1997-04-01

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361752, 361736, 361816, 361760, 174 522, 257787, 257789, H05K 114, H05K 103

Patent

active

056172974

ABSTRACT:
A portable peripheral card for an electrical device is disclosed that has an injected molded housing package. In one aspect of the invention, the peripheral card has a printed circuit board, a female electrical connector, and a solid one-piece injected molded package, whereas the molding compound includes organic polymer fibers. The printed circuit board has electrical components mounted thereon and the female electrical connector is attached to the printed circuit board to permit communications between the electrical components on the printed circuit board and the electrical device. The solid one-piece package encapsulates the printed circuit board and the electrical components yet exposes a portion of the electrical connector to facilitate electrical connections between the printed circuit board and the electrical device. In one preferred embodiment, the organic polymer fibers includes at least one selected from the group consisting of cotton, cellulose, polyester and nylon. In another preferred embodiment, the portable peripheral card is a PCMCIA card. In another preferred embodiment, the filler includes silica and organic polymer fibers. Methods of manufacturing such peripheral cards are also disclosed.

REFERENCES:
patent: 5208732 (1993-05-01), Baudouin et al.
patent: 5319522 (1994-06-01), Mehta
patent: 5406117 (1995-04-01), Dlugokecki et al.
patent: 5554821 (1996-09-01), Patterson et al.

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