Method for coating substrates with silicon based compounds

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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C23C 1414

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active

050471317

ABSTRACT:
A method of depositing thin films of silicon based compounds, particularly silicon dioxide, by cathode reactive sputtering utilizes a rotating cylindrical magnetron driven by a d.c. potential. The result is a technique of forming a uniform film on large substrates with high deposition rates. Arcing normally associated with sputtering troublesome dielectric coatings such as silicon oxides is substantially eliminated.

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