Process for the production of metal clad thermoplastic base mate

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

1563082, 1563096, 1563099, 156322, 156902, B32B 3120, B32B 3126

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active

050471147

ABSTRACT:
A process for bonding metal directly to thermoplastic polymeric base materials and a process for producing printed circuits from such metal clad thermoplastic polymeric base materials are provided. The invention also includes the articles so produced. Metal clad thermoplastic polymeric base materials are produced by laminating a metal foil or sheet to thermoplastic polymeric base material, under pressure, at a temperature from about 2.degree. C. to about 45.degree. C. above the glass transition temperature (Tg) of the thermoplastic. The polymeric material is free of volatile materials such as moisture or solvents when laminated.

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Naegle, Peter J., "Polysulfone: Its Microwave Properties", presented at IPC Annual Meeting, IPC-TP-319, Apr. 1980.
Going, Timothy J., "Polyetherimide: A New High Performance Polymer for Printed Circuit Applications", ASEP Annual Mtg., Oct. 1982.

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