Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1976-04-29
1978-02-14
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 204192E, 204298, 252 791, C23F 102
Patent
active
040736695
ABSTRACT:
Aluminum films on a semiconductor surface are etched in a carbon tetrachloride glow discharge. Typical etch rates are 2000-3000 A/min. The addition of 15% ammonia to the plasma prevents HCl formation when the etched material is exposed to air.
This process provides a more easily controlled process for the manufacture of high density integrated circuits.
REFERENCES:
patent: 3620957 (1971-11-01), Crawley et al.
patent: 3860507 (1975-01-01), Vossen
patent: 3975252 (1976-08-01), Fraser et al.
Ashcroft Geoffrey L.
Heinecke Rudolf A. H.
ITT Industries Incorporated
O'Halloran John T.
Powell William A.
Van Der Sluys Peter C.
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